Electroless nickel plating process model for plated-through-hole board manufacturing

R. Tenno, Kalle Kantola, A. Tenno

    Research output: Contribution to journalArticleScientificpeer-review

    6 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)1825-1836
    JournalJournal of Electronic Materials
    Volume35
    Issue number10
    Publication statusPublished - 2006
    MoE publication typeA1 Journal article-refereed

    Keywords

    • electroless plating
    • modeling
    • nickel
    • state estimation

    Cite this