Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections

Toni Tuomas Mattila, Hongbo Xu, Otso Ratia, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

28 Citations (Scopus)
Original languageEnglish
Title of host publication60th Electronic Components and Technology conference, Las Vegas, Nv, June 1-4, June 2010
PublisherIEEE CPMT
ISBN (Electronic)978-1-4244-6411-1
ISBN (Print)978-1-4244-6410-4
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication

Publication series

ISSN (Print)0569-5503
ISSN (Electronic)0569-5503

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