EFFECTS OF SERVICE AND MATERIAL VARIABLES ON THE FATIGUE BEHAVIOR OF SOLDER JOINTS DURING THE THERMAL CYCLE

Donald Stone, Simo-Pekka Hannula, Che Yu Li

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

The deformation of solder joints in microelectronic components during a thermal cycle is analyzed. The stresses encountered by a solder joint are estimated based on a geometrically simplified model of a solder joint assembly. A solder flow law that includes grain boundary sliding is incorporated into the model, which is shown to reproduce satisfactorily the measured behavior of a more complex assembly. It is suggested that this flow law can also be used to assess the different damage mechanisms and the stress-strain rate-temperature regimes in which the different damage mechanisms operate. The effects of a number of variables on the stress-time profile and solder joint fatigue during a thermal cycle are examined. These variables include the amplitude and frequency of the thermal frequency of the thermal cycle, the stiffness of the soldered assembly, and the grain size of the solder.
Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages46-51
Number of pages6
Publication statusPublished - 1985
MoE publication typeA4 Article in a conference publication
EventElectronic Components and Technology Conference - Washington, United States
Duration: 1 Jan 19851 Jan 1985
Conference number: 35

Publication series

NameProceedings - Electronic Components and Technology Conference
PublisherIEEE
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components and Technology Conference
CountryUnited States
CityWashington
Period01/01/198501/01/1985

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