Effect of Ti on the interfacial reaction between Sn and Cu

Research output: Contribution to journalArticleScientificpeer-review

9 Citations (Scopus)
Original languageEnglish
Pages (from-to)68-74
JournalJournal of Materials Science: Materials in Electronics
Volume23
Issue number1
DOIs
Publication statusPublished - 2012
MoE publication typeA1 Journal article-refereed

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