Effect of Ti on the interfacial reaction between Sn and Cu

Research output: Contribution to journal › Article › Scientific › peer-review

9 Citations (Scopus)

Original language	English
Pages (from-to)	68-74
Journal	Journal of Materials Science: Materials in Electronics
Volume	23
Issue number	1
DOIs	https://doi.org/10.1007/s10854-011-0426-6
Publication status	Published - 2012
MoE publication type	A1 Journal article-refereed

Access to Document

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title = "Effect of Ti on the interfacial reaction between Sn and Cu",

author = "Vesa Vuorinen and Hongqun Dong and Tomi Laurila",

year = "2012",

doi = "10.1007/s10854-011-0426-6",

language = "English",

volume = "23",

pages = "68--74",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

publisher = "Springer New York",

number = "1",

}

TY - JOUR

T1 - Effect of Ti on the interfacial reaction between Sn and Cu

AU - Vuorinen, Vesa

AU - Dong, Hongqun

AU - Laurila, Tomi

PY - 2012

Y1 - 2012

UR - http://www.springerlink.com/content/r59wtx6484513jx1/

U2 - 10.1007/s10854-011-0426-6

DO - 10.1007/s10854-011-0426-6

M3 - Article

VL - 23

SP - 68

EP - 74

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

SN - 0957-4522

IS - 1

ER -