Effect of Thermal Stresses along Crack Surface on Ultrasonic Response

Iikka Virkkunen, Mika Kemppainen, Jorma Pitkänen, Hannu Hänninen

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationREVIEW OF PROGRESS IN QUANTITATIVE NONDESTRUCTIVE EVALUATION, VOLS 23A AND 23B
EditorsD.O. Thompson, D.E. Chimenti
PublisherAmerican Institute of Physics
Pages1224-1231
Number of pages8
Volume23
EditionA & B
ISBN (Print)0-7354-0173-X
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
EventAnnual Review of Progress in Quantitative Nondestructive Evaluation - Green Bay, United States
Duration: 27 Jul 20031 Aug 2003
Conference number: 30

Conference

ConferenceAnnual Review of Progress in Quantitative Nondestructive Evaluation
Abbreviated titleQNDE
CountryUnited States
CityGreen Bay
Period27/07/200301/08/2003

Keywords

  • cracking
  • thermal stress
  • ultrasonic inspection

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