Effect of Temperature on the Drop Reliability of Electronic Assemblies

Toni T. Mattila, Rony James, Luu Nguyen, Jorma Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007
Publisher	IEEE
Pages	940-945
Publication status	Published - 2007
MoE publication type	A4 Conference publication

Cite this

@inproceedings{2d343768b0b5484eb48cf7b1d04b8cad,

title = "Effect of Temperature on the Drop Reliability of Electronic Assemblies",

author = "Mattila, {Toni T.} and Rony James and Luu Nguyen and Jorma Kivilahti",

year = "2007",

language = "English",

pages = "940--945",

booktitle = "57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007",

publisher = "IEEE",

address = "United States",

}

TY - GEN

T1 - Effect of Temperature on the Drop Reliability of Electronic Assemblies

AU - Mattila, Toni T.

AU - James, Rony

AU - Nguyen, Luu

AU - Kivilahti, Jorma

PY - 2007

Y1 - 2007

UR - http://ieeexplore.ieee.org/Xplore/guesthome.jsp

M3 - Conference article in proceedings

SP - 940

EP - 945

BT - 57th Electronic Component and Technology Conference, Reno, NV, May 29- June 1, 2007

PB - IEEE

ER -