Effect of Ni on the Formation of Cu6Sn5 and Cy3Sn Intermetallics

Hao Yu, Vesa Vuorinen, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    19 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)293-298
    JournalIEEE Transactions on Electronics Packaging Manufacturing
    Volume30
    Issue number4
    Publication statusPublished - 2007
    MoE publication typeA1 Journal article-refereed

    Cite this