Original language | English |
---|---|
Pages (from-to) | 293-298 |
Journal | IEEE Transactions on Electronics Packaging Manufacturing |
Volume | 30 |
Issue number | 4 |
Publication status | Published - 2007 |
MoE publication type | A1 Journal article-refereed |
Effect of Ni on the Formation of Cu6Sn5 and Cy3Sn Intermetallics
Hao Yu, Vesa Vuorinen, Jorma Kivilahti
Research output: Contribution to journal › Article › Scientific › peer-review
20
Citations
(Scopus)