Effect of Ni on the formation of Cu6Sn5 and Cu5Sn intermetallics

H. Yu, V. Vuorinen, J.K. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    20 Citations (Scopus)
    Original languageEnglish
    Title of host publicationthe 56th Electronic Components and Packaging Technology (ECTC) San Diego, CA, USA May 30 to June 2 2006
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication


    • intermetallic

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