Effect of Ni on the formation of Cu6Sn5 and Cu5Sn intermetallics

Hao Yu, V. Vuorinen, J.K. Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	the 56th Electronic Components and Packaging Technology (ECTC) San Diego, CA, USA May 30 to June 2 2006
Pages	1204-1209
Publication status	Published - 2006
MoE publication type	A4 Conference publication

Keywords

@inproceedings{8d57460bdbae4df2b829b6b54f2f1269,

title = "Effect of Ni on the formation of Cu6Sn5 and Cu5Sn intermetallics",

keywords = "intermetallic, intermetallic, intermetallic",

author = "Hao Yu and V. Vuorinen and J.K. Kivilahti",

year = "2006",

language = "English",

pages = "1204--1209",

booktitle = "the 56th Electronic Components and Packaging Technology (ECTC) San Diego, CA, USA May 30 to June 2 2006",

}

TY - GEN

T1 - Effect of Ni on the formation of Cu6Sn5 and Cu5Sn intermetallics

AU - Yu, Hao

AU - Vuorinen, V.

AU - Kivilahti, J.K.

PY - 2006

Y1 - 2006

KW - intermetallic

M3 - Conference article in proceedings

SP - 1204

EP - 1209

BT - the 56th Electronic Components and Packaging Technology (ECTC) San Diego, CA, USA May 30 to June 2 2006

ER -