Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Research output: Contribution to journal › Article › Scientific › peer-review
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Original language | English |
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Pages (from-to) | 644-653 |
Journal | Journal of Materials Science: Materials in Electronics |
Issue number | 24 |
Publication status | Published - 2013 |
MoE publication type | A1 Journal article-refereed |
ID: 961618