By same authors

1. Microstructural Evolution and Mechanical Properties in (AuSn)_eut-Cu Interconnections

   Research output: Contribution to journal › Article › Scientific › peer-review

2. Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

   Research output: Contribution to journal › Article › Scientific › peer-review

3. Thermodynamic reassessment of Au-Cu-Sn ternary system

   Research output: Contribution to journal › Article › Scientific › peer-review

4. Thermodynamic reassessment of Au-Ni-Sn ternary system

   Research output: Contribution to journal › Article › Scientific › peer-review

5. Thermodynamic modeling of Au-Ce-Sn ternary system

   Research output: Contribution to journal › Article › Scientific › peer-review

Output related by journal

1. Influence of metal assisted chemical etching time period on mesoporous structure in as-cut upgraded metallurgical grade silicon for solar cell application

   Research output: Contribution to journal › Article › Scientific › peer-review

2. The effect of platinum contact metallization on Cu/Sn bonding

   Research output: Contribution to journal › Article › Scientific › peer-review

3. Effect of Cu doping on TiO₂ nanoparticles and its photocatalytic activity under visible light

   Research output: Contribution to journal › Article › Scientific › peer-review

4. Effect of Ti on the interfacial reaction between Sn and Cu

   Research output: Contribution to journal › Article › Scientific › peer-review