Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

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Original languageEnglish
Pages (from-to)3179-3195
JournalJournal of Electronic Materials
Volume41
Issue number11
Publication statusPublished - 2012
MoE publication typeA1 Journal article-refereed

    Research areas

  • electromigration, interfacial reactions

ID: 835505