Effect of Dissolution and Intermetallic Formation on the Reliability of FC joints

K. Kulojärvi, J. Kivilahti

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

40 Citations (Scopus)
Original languageEnglish
Title of host publicationThe 34th ISHM-Nordic Annual Conference, Oslo, 21.24.9.1997
EditorsPaul Collander
Place of PublicationOslo
PublisherInternational Society for Hybrid Microelectronics (ISHM)
Pages51-58
Publication statusPublished - 1997
MoE publication typeA4 Conference publication

Keywords

  • flip chip
  • intermetallics
  • UBM

Cite this