Effect of addition of manganese and antimony on viscoplastic properties and cyclic mechanical durability of low silver Sn-Ag-Cu solder

Subhasis Mukherjee, Toni T. Mattila, Abhijit Dasgupta

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    6 Citations (Scopus)
    Original languageEnglish
    Title of host publication13th IEEE Intersociety Conference onThermal and Thermomechanical Phenomena in Electronic Systems, San Diego, CA, May 30 June 1, 2012
    PublisherIEEE CPMT
    ISBN (Print)978-1-4244-9532-0
    Publication statusPublished - 2012
    MoE publication typeA4 Article in a conference publication

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