Effect of 0.5 wt% Cu in Sn-3.5% Ag solder ball on the solid state interfacial reaction with the Au/Ni/Cu bond bad for Ball Grid Array (BGA) application

M.O. Alam, Y.C. Chan, K.N. Tu, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    31 Citations (Scopus)
    Original languageEnglish
    JournalChemistry of Materials
    Issue number9
    Publication statusPublished - 2005
    MoE publication typeA1 Journal article-refereed

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