Drop Test Reliability of Wafer Level Chip Scale Packages

Mikko Alajoki, Luu Nguyen, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    64 Citations (Scopus)
    Original languageEnglish
    Title of host publicationIEEE ECTE 2005, Electronic Component and Technology Conference, Orlando, USA, 31.May to 3. June 2005
    PublisherIEEE CPMT
    Publication statusPublished - 2005
    MoE publication typeA4 Article in a conference publication

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