Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations

Jingshi Meng; Toni T. Mattila; Abhijit Dasgupta; Markku Sillanpää; Reino Jaakkola; Guoping Luo; Klas Anderson

doi:10.1109/ITHERM.2012.6231537

Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations

Jingshi Meng, Toni T. Mattila, Abhijit Dasgupta, Markku Sillanpää, Reino Jaakkola, Guoping Luo, Klas Anderson

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

12 Citations (Scopus)

Original language	English
Title of host publication	13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012)
Publisher	IEEE CPMT
Pages	1020-1027
ISBN (Print)	978-1-4244-9532-0
DOIs	https://doi.org/10.1109/ITHERM.2012.6231537
Publication status	Published - 2012
MoE publication type	A4 Article in a conference publication

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10.1109/ITHERM.2012.6231537

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Meng, J., Mattila, T. T., Dasgupta, A., Sillanpää, M., Jaakkola, R., Luo, G., & Anderson, K. (2012). Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations. In 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012) (pp. 1020-1027). IEEE CPMT. https://doi.org/10.1109/ITHERM.2012.6231537

@inproceedings{6e8ab3578b80437f90191da8cf35528f,

title = "Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations",

author = "Jingshi Meng and Mattila, {Toni T.} and Abhijit Dasgupta and Markku Sillanp{\"a}{\"a} and Reino Jaakkola and Guoping Luo and Klas Anderson",

year = "2012",

doi = "10.1109/ITHERM.2012.6231537",

language = "English",

isbn = "978-1-4244-9532-0",

pages = "1020--1027",

booktitle = "13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012)",

publisher = "IEEE CPMT",

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Meng, J, Mattila, TT, Dasgupta, A, Sillanpää, M, Jaakkola, R, Luo, G & Anderson, K 2012, Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations. in 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012). IEEE CPMT, pp. 1020-1027. https://doi.org/10.1109/ITHERM.2012.6231537

Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations. / Meng, Jingshi; Mattila, Toni T.; Dasgupta, Abhijit; Sillanpää, Markku; Jaakkola, Reino; Luo, Guoping; Anderson, Klas.

13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012). IEEE CPMT, 2012. p. 1020-1027.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations

AU - Meng, Jingshi

AU - Mattila, Toni T.

AU - Dasgupta, Abhijit

AU - Sillanpää, Markku

AU - Jaakkola, Reino

AU - Luo, Guoping

AU - Anderson, Klas

PY - 2012

Y1 - 2012

UR - http://ieeexplore.ieee.org/Xplore/guesthome.jsp

U2 - 10.1109/ITHERM.2012.6231537

DO - 10.1109/ITHERM.2012.6231537

M3 - Conference contribution

SN - 978-1-4244-9532-0

SP - 1020

EP - 1027

BT - 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012)

PB - IEEE CPMT

ER -

Drop Qualification of MEMS Components in Handheld Electronics at Extremely High Accelerations

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