Development of New Solder Fillers for Uniaxially Conductive Adhesives

J. Kivilahti, P. Savolainen, T. Nykänen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationInternational Seminar on Recent Achievements in Conductive Adhesive Joining Technology in Electronics Manufacture, Gothenburg 1993
    Place of PublicationGothenburg
    PublisherSwedish Institute of Production Engineering Research
    Pages123-124
    Publication statusPublished - 1993
    MoE publication typeA4 Article in a conference publication

    Keywords

    • conductive adhesive

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