Projects per year
Abstract
Copper is the major impurity dissolved in silver electrorefining which potentially accumulates in the electrolyte during the process and co-deposits onto the cathode surface, decreasing the product quality. The study investigated the dissolution kinetics of copper in silver electrorefining as a function of wt%Cu in the industrial electrolyte ranges of 40–100 g/dm3 [Ag+], 5–15 g/dm3 [HNO3] and 20–60 g/dm3 [Cu2+] at 25–45 °C. The results showed that Cu dissolved at a higher rate in comparison to silver and that the two kinetic models developed have good accuracy and validity. From the models, optimal electrolyte circulation parameters were simulated to avoid [Cu2+] accumulation in the electrolyte. As a conclusion, processing 1% Cu anodes at the critical [Cu2+]/[Ag+] ratio of 0.8 in the electrolyte requires an inlet of [Ag+] of 2.3–3.3 and tolerates [Cu2+] of 0.14–0.47 times that of the [Ag+] and [Cu2+] in the bulk electrolyte, respectively. Furthermore, electrolyte with higher [Ag+] provides the benefit of reduced electrolyte circulation flowrate and increased tolerance of wt%-Cu in the silver anodes.
Original language | English |
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Article number | 105403 |
Journal | Hydrometallurgy |
Volume | 196 |
Early online date | 20 Jun 2020 |
DOIs | |
Publication status | Published - 1 Sep 2020 |
MoE publication type | A1 Journal article-refereed |
Keywords
- Copper dissolution
- Model-bassed process design
- Silver electrorefining
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Projects
- 2 Finished
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SYMMET (HYDRO)
Lundström, M., Kalliomäki, T., Aji, A. & Liu, F.
01/11/2018 → 31/10/2020
Project: Business Finland: Other research funding
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CMEco: Circular Metal Ecosystem
Aji, A., Kalliomäki, T., Seisko, S., Leikola, M., Jafari, S., Elomaa, H., Hamuyuni, J., Khalid, M. K., Lundström, M., Halli, P., Sinisalo, P., Wilson, B., Revitzer, H., Partinen, J. & Wang, Z.
01/01/2017 → 30/04/2019
Project: Business Finland: Other research funding
Equipment
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Raw Materials Research Infrastructure
Maarit Karppinen (Manager)
School of Chemical EngineeringFacility/equipment: Facility