Design for reliability of Au-Sn and Cu-Sn based SLID bonds

Vesa Vuorinen*, Antti Rautiainen, Mervi Paulasto-Kröckel

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

Solid-Liquid Interdiffusion (SLID) bonding is a novel and attractive method for producing high strength, high melting point and microstructurally stabile interconnections for power electronic components, 3D packaging solutions and hermetic encapsulation for MEMS devices. However, there are quite a few different types of manufacturing related defects, which can have a significant effect on functionality and reliability performance of the SLID interconnections. With proper design for manufacturability i.e. by selecting the correct materials and by controlling their purity as well as by utilizing the optimal process parameters, the amount and effects of these defects can be minimized. In addition, in order to control the formation and evolution of the interconnection microstructure for high mechanical reliability the compatibility between the bonding materials and contact metallizations must be unambiguously defined and ensured.

Original languageEnglish
Title of host publication20th European Microelectronics and Packaging Conference and Exhibition
PublisherIEEE
Number of pages6
ISBN (Electronic)978-0-9568-0862-2
ISBN (Print)978-0-9568086-1-5
Publication statusPublished - 25 Jan 2016
MoE publication typeA4 Article in a conference publication
EventEuropean Microelectronics and Packaging Conference - Friedrichshafen, Germany
Duration: 14 Sep 201516 Sep 2015
Conference number: 20

Conference

ConferenceEuropean Microelectronics and Packaging Conference
Abbreviated titleEMPC
CountryGermany
CityFriedrichshafen
Period14/09/201516/09/2015

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