Crystal plasticity model for creep and relaxation deformation of OFP copper

Tom Andersson*, Matti Lindroos, Rami Pohja, Abhishek Biswas, Supriya Nandy, Janne Pakarinen, Juhani Rantala

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

Abstract

We demonstrate a dislocation density-based crystal plasticity (CP) model approach for simulating mesoscale deformation and damage. The existing CP framework is extended to be compatible with the oxygen-free phosphorous copper microstructure that is the focus of this study. The key aim is to introduce relevant plastic deformation mechanisms and to develop a failure model capable of depicting creep damage in the material. The effect of local variations in material is evaluated, and the model response is compared with experiments and characterisation. The basis of this work is CP material modelling, including grain orientation and size, obtained using electron backscatter diffraction and experimental test data of real relaxation test specimens. This will yield a realistic description of texture and grain shape and, ultimately, accurate stress–strain response at the microstructural level for further evaluation of performance with respect to material creep(−fatigue) damage.

Original languageEnglish
Number of pages10
JournalMATERIALS AT HIGH TEMPERATURES
DOIs
Publication statusE-pub ahead of print - 6 Nov 2023
MoE publication typeA1 Journal article-refereed

Keywords

  • Creep
  • creep cavity
  • crystal plasticity modelling

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