Crossover between Electron-Phonon and Boundary-Resistance Limits to Thermal Relaxation in Copper Films

L. B. Wang*, O-P Saira, D. S. Golubev, J. P. Pekola

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

3 Citations (Scopus)
120 Downloads (Pure)

Abstract

We observe a crossover fromelectron-phonon (e-ph) coupling limited energy relaxation to that governed by thermal boundary resistance (phonon-phonon coupling, ph-ph) in copper films at subkelvin temperatures. Our measurement yields a quantitative picture of heat currents, in terms of temperature dependences and magnitudes, in both e-ph and pp limited regimes, respectively. We show that by adding a third layer in between the copper film and the substrate, the thermal boundary resistance is increased fourfold, consistent with an assumed series connection of thermal resistances.

Original languageEnglish
Article number024051
Pages (from-to)1-6
Number of pages6
JournalPhysical Review Applied
Volume12
Issue number2
DOIs
Publication statusPublished - 23 Aug 2019
MoE publication typeA1 Journal article-refereed

Keywords

  • HEAT-CONDUCTION
  • HOT-ELECTRONS
  • QUANTUM
  • MULTILAYERS

Projects

Equipment

OtaNano

Anna Rissanen (Manager)

Aalto University

Facility/equipment: Facility

  • Cite this