Abstract
Millimeter-wave antenna arrays place integrated transceiver chips and antennas in close proximity to each other. As a result, the presence of the chip will affect the performance of the system significantly, with the metallic structures within the chip being a source for structural resonances. A transition which utilizes one of these metallic structures, the crack stop, as a coupling element is presented. The proposed design allows a non-galvanic connection between the IC chip and the antenna. The performance of the transition is analyzed through simulations, and is shown to reach above-70-percent power transmission between 42.3 GHz and 62 GHz, covering the majority of V-band.
| Original language | English |
|---|---|
| Title of host publication | 18th European Conference on Antennas and Propagation, EuCAP 2024 |
| Publisher | IEEE |
| ISBN (Print) | 979-8-3503-9443-6 |
| DOIs | |
| Publication status | Published - 2024 |
| MoE publication type | A4 Conference publication |
| Event | European Conference on Antennas and Propagation - Glasgow, United Kingdom Duration: 17 Mar 2024 → 22 Mar 2024 Conference number: 18 |
Conference
| Conference | European Conference on Antennas and Propagation |
|---|---|
| Abbreviated title | EuCAP |
| Country/Territory | United Kingdom |
| City | Glasgow |
| Period | 17/03/2024 → 22/03/2024 |
Funding
This work was supported by Business Finland through the ENTRY100GHz CELTIC-NEXT project, as well as Walter Ahlström Foundation and HPY Research Foundation. Research infrastructure provided by Aalto Electronics-ICT was utilized for this work.
Keywords
- antenna arrays
- aperture coupled antennas
- integrated circuits
- millimeter wave devices
- simulations
Fingerprint
Dive into the research topics of 'Crack Stop as a Coupling Element Between an IC Chip and Antenna'. Together they form a unique fingerprint.Projects
- 1 Finished
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ENTRY100GHz: Energy-Efficient Radio Systems at 100 GHz and beyond: Antennas, Transceivers and Waveforms
Viikari, V. (Principal investigator), Andersson, S. (Project Member), Karki, S. (Project Member), Lehtovuori, A. (Project Member), Pietiläinen, E. (Project Member), Bergman, J. (Project Member), Salmi, A. (Project Member), Ala-Laurinaho, J. (Project Member), Jokiniemi, K. (Project Member), Öhman, S. (Project Member), Kankkunen, E. (Project Member), Leelarathne, G. (Project Member), Ryynänen, K. (Project Member), Stadius, K. (Project Member) & Ryynänen, J. (Co-PI)
01/06/2021 → 31/05/2024
Project: EU Other competitive funding
Equipment
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Aalto Electronics-ICT
Ryynänen, J. (Manager)
Department of Electronics and NanoengineeringFacility/equipment: Facility
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