CORRELATING THE MECHANICAL PROPERTIES OF FINE WIRE TO ITS PERFORMANCE DURING WIRE BONDING

S. P. Hannula*, J. Wanagel, C. Y. Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationProceedings - Electronic Components and Technology Conference
PublisherIEEE
Pages31-35
Number of pages5
Publication statusPublished - 1984
MoE publication typeA4 Article in a conference publication
EventElectronic Components Conference - New Orleans, United States
Duration: 1 Jan 19841 Jan 1984
Conference number: 34

Publication series

NameProceedings - Electronic Components and Technology Conference
PublisherIEEE
ISSN (Print)0569-5503

Conference

ConferenceElectronic Components Conference
CountryUnited States
CityNew Orleans
Period01/01/198401/01/1984

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