Correlating integrated circuit process induced strain and defects against device yield and process control monitoring data

M. Karilahti, T. Tuomi, R. Rantamäki, P.J. McNally, A.N. Danilewsky

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe 4th International Conference on Materials for Microelectronics and Nanoengineering ICMMN-4, Espoo, Finland, 10-12 June, 2002
    Publication statusPublished - 2002
    MoE publication typeA4 Article in a conference publication


    • semiconductors
    • synchrotron x-ray topography

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