Contactless electrical sintering of silver nanoparticles on flexible substrates

M. Allen, A. Alastalo, M. Suhonen, T. Mattila, J. Leppaniemi, H. Seppa

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    52 Citations (Scopus)
    Original languageEnglish
    Title of host publication2010 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM 2010
    Pages1419-1429
    DOIs
    Publication statusPublished - 2011
    MoE publication typeA4 Article in a conference publication
    EventIEEE Radio Frequency Integrated Circuits Symposium - Anaheim, United States
    Duration: 23 May 201025 May 2010

    Publication series

    Name
    ISSN (Print)0018-9480

    Conference

    ConferenceIEEE Radio Frequency Integrated Circuits Symposium
    Abbreviated titleRFIC
    CountryUnited States
    CityAnaheim
    Period23/05/201025/05/2010

    Keywords

    • Flexible substrate
    • impedance matching
    • inkjet printing
    • nanoparticle ink
    • near-field coupling
    • rapid electrical sintering (RES)

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