@inproceedings{bb9c663fc0d441bd857740ec163390ec,
title = "Constitutive Models for Stress Analysis of Solder Joints",
keywords = "creep, microstructure, reliability, solder joints, viscoplasticity, creep, microstructure, reliability, solder joints, viscoplasticity, creep, microstructure, reliability, solder joints, viscoplasticity",
author = "Reijo Kouhia and P. Marjam{\"a}ki and Jorma Kivilahti",
year = "1999",
language = "English",
isbn = "951-22-4731-3",
publisher = "Helsinki University of Technology",
number = "57",
pages = "31--34",
editor = "R. Kouhia and M. Mikkola",
booktitle = "The Twelft Nordic Seminar on Computational Mechanics (NSCM-12), Espoo, HUT, 22-23 October 1999",
address = "Finland",
}