Constitutive Models for Stress Analysis of Solder Joints

Reijo Kouhia, P. Marjamäki, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe Twelft Nordic Seminar on Computational Mechanics (NSCM-12), Espoo, HUT, 22-23 October 1999
    EditorsR. Kouhia, M. Mikkola
    Place of PublicationEspoo
    PublisherHelsinki University of Technology, Laboratory of Theoretical and Applied Mechanics
    Pages31-34
    Publication statusPublished - 1999
    MoE publication typeA4 Article in a conference publication

    Keywords

    • creep
    • microstructure
    • reliability
    • solder joints
    • viscoplasticity

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