Conducting Adhesives: Flip Chip Assembly with Solder-Filled Adhesives

P. Savolainen; Jorma Kivilahti

Conducting Adhesives: Flip Chip Assembly with Solder-Filled Adhesives

P. Savolainen, Jorma Kivilahti

Department of Electrical Engineering and Automation

Research output: Working paper › Professional

Original language	English
Place of Publication	Helsinki
Publication status	Published - 1996
MoE publication type	D4 Published development or research report or study

Keywords

assembly
flip chip
solder-filled adhesives

Cite this

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title = "Conducting Adhesives: Flip Chip Assembly with Solder-Filled Adhesives",

keywords = "assembly, flip chip, solder-filled adhesives, assembly, flip chip, solder-filled adhesives, assembly, flip chip, solder-filled adhesives",

author = "P. Savolainen and Jorma Kivilahti",

year = "1996",

language = "English",

isbn = "951-53-0466-0",

type = "WorkingPaper",

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T1 - Conducting Adhesives: Flip Chip Assembly with Solder-Filled Adhesives

AU - Savolainen, P.

AU - Kivilahti, Jorma

PY - 1996

Y1 - 1996

KW - assembly

KW - flip chip

KW - solder-filled adhesives

KW - assembly

KW - flip chip

KW - solder-filled adhesives

KW - assembly

KW - flip chip

KW - solder-filled adhesives

M3 - Working paper

SN - 951-53-0466-0

BT - Conducting Adhesives: Flip Chip Assembly with Solder-Filled Adhesives

CY - Helsinki

ER -