@article{9b66d697fb7b4c17872227af95ef5711,
title = "Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests",
keywords = "drop test, elevated temperatures, finite element method, mixed loading conditions, reliability, drop test, elevated temperatures, finite element method, mixed loading conditions, reliability, drop test, elevated temperatures, finite element method, mixed loading conditions, reliability",
author = "Jue Li and Toni Mattila and Jorma Kivilahti",
year = "2009",
language = "English",
volume = "32",
pages = "38--43",
journal = "IEEE Transactions on Components and Packaging Technologies",
publisher = "IEEE",
number = "1",
}