Computational Assessment of the Effects of Temperature on Wafer-Level Component Boards in Drop Tests

Jue Li, Toni Mattila, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)38-43
    JournalIEEE Transactions on Components and Packaging Technologies
    Issue number1
    Publication statusPublished - 2009
    MoE publication typeA1 Journal article-refereed


    • drop test
    • elevated temperatures
    • finite element method
    • mixed loading conditions
    • reliability

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