Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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Comparative study on radio frequency and reliability performance of electronically conductive adhesives. / Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi.

2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers, 2016. 7764732.

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Harvard

Österlund, E, Vuorinen, V, Jokilahti, J, Galkin, T, Salmela, O & Paulasto-Krockel, M 2016, Comparative study on radio frequency and reliability performance of electronically conductive adhesives. in 2016 6th Electronic System-Integration Technology Conference, ESTC 2016., 7764732, Institute of Electrical and Electronics Engineers, Electronic System Integration Technology Conference, Grenoble, France, 13/09/2016. https://doi.org/10.1109/ESTC.2016.7764732

APA

Österlund, E., Vuorinen, V., Jokilahti, J., Galkin, T., Salmela, O., & Paulasto-Krockel, M. (2016). Comparative study on radio frequency and reliability performance of electronically conductive adhesives. In 2016 6th Electronic System-Integration Technology Conference, ESTC 2016 [7764732] Institute of Electrical and Electronics Engineers. https://doi.org/10.1109/ESTC.2016.7764732

Vancouver

Österlund E, Vuorinen V, Jokilahti J, Galkin T, Salmela O, Paulasto-Krockel M. Comparative study on radio frequency and reliability performance of electronically conductive adhesives. In 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers. 2016. 7764732 https://doi.org/10.1109/ESTC.2016.7764732

Author

Österlund, Elmeri ; Vuorinen, Vesa ; Jokilahti, Juha ; Galkin, Timo ; Salmela, Olli ; Paulasto-Krockel, Mervi. / Comparative study on radio frequency and reliability performance of electronically conductive adhesives. 2016 6th Electronic System-Integration Technology Conference, ESTC 2016. Institute of Electrical and Electronics Engineers, 2016.

Bibtex - Download

@inproceedings{ed6266ea1b0d49a9bdf8784d8f2085c2,
title = "Comparative study on radio frequency and reliability performance of electronically conductive adhesives",
abstract = "ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.",
author = "Elmeri {\"O}sterlund and Vesa Vuorinen and Juha Jokilahti and Timo Galkin and Olli Salmela and Mervi Paulasto-Krockel",
year = "2016",
month = "12",
day = "1",
doi = "10.1109/ESTC.2016.7764732",
language = "English",
booktitle = "2016 6th Electronic System-Integration Technology Conference, ESTC 2016",
publisher = "Institute of Electrical and Electronics Engineers",
address = "United States",

}

RIS - Download

TY - GEN

T1 - Comparative study on radio frequency and reliability performance of electronically conductive adhesives

AU - Österlund, Elmeri

AU - Vuorinen, Vesa

AU - Jokilahti, Juha

AU - Galkin, Timo

AU - Salmela, Olli

AU - Paulasto-Krockel, Mervi

PY - 2016/12/1

Y1 - 2016/12/1

N2 - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

AB - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

UR - http://www.scopus.com/inward/record.url?scp=85015043158&partnerID=8YFLogxK

U2 - 10.1109/ESTC.2016.7764732

DO - 10.1109/ESTC.2016.7764732

M3 - Conference contribution

BT - 2016 6th Electronic System-Integration Technology Conference, ESTC 2016

PB - Institute of Electrical and Electronics Engineers

ER -

ID: 13574569