Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund, Vesa Vuorinen, Juha Jokilahti, Timo Galkin, Olli Salmela, Mervi Paulasto-Krockel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

Original languageEnglish
Title of host publication2016 6th Electronic System-Integration Technology Conference, ESTC 2016
PublisherIEEE
Number of pages5
ISBN (Electronic)978-1-5090-1402-6
DOIs
Publication statusPublished - 1 Dec 2016
MoE publication typeA4 Article in a conference publication
EventElectronic System Integration Technology Conference - Grenoble, France
Duration: 13 Sep 201616 Sep 2016
Conference number: 6

Conference

ConferenceElectronic System Integration Technology Conference
Abbreviated titleESTC
CountryFrance
CityGrenoble
Period13/09/201616/09/2016

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