Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund; Vesa Vuorinen; Juha Jokilahti; Timo Galkin; Olli Salmela; Mervi Paulasto-Krockel

doi:10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Elmeri Österlund, Vesa Vuorinen, Juha Jokilahti, Timo Galkin, Olli Salmela, Mervi Paulasto-Krockel

Nokia Bell Labs Finland

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

Original language	English
Title of host publication	2016 6th Electronic System-Integration Technology Conference, ESTC 2016
Publisher	IEEE
Number of pages	5
ISBN (Electronic)	978-1-5090-1402-6
DOIs	https://doi.org/10.1109/ESTC.2016.7764732
Publication status	Published - 1 Dec 2016
MoE publication type	A4 Conference publication
Event	Electronic System Integration Technology Conference - Grenoble, France Duration: 13 Sept 2016 → 16 Sept 2016 Conference number: 6

Conference

Conference	Electronic System Integration Technology Conference
Abbreviated title	ESTC
Country/Territory	France
City	Grenoble
Period	13/09/2016 → 16/09/2016

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10.1109/ESTC.2016.7764732

Cite this

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title = "Comparative study on radio frequency and reliability performance of electronically conductive adhesives",

abstract = "ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.",

author = "Elmeri {\"O}sterlund and Vesa Vuorinen and Juha Jokilahti and Timo Galkin and Olli Salmela and Mervi Paulasto-Krockel",

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Österlund, E, Vuorinen, V, Jokilahti, J, Galkin, T, Salmela, O & Paulasto-Krockel, M 2016, Comparative study on radio frequency and reliability performance of electronically conductive adhesives. in 2016 6th Electronic System-Integration Technology Conference, ESTC 2016., 7764732, IEEE, Electronic System Integration Technology Conference, Grenoble, France, 13/09/2016. https://doi.org/10.1109/ESTC.2016.7764732

Comparative study on radio frequency and reliability performance of electronically conductive adhesives. / Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha et al.
2016 6th Electronic System-Integration Technology Conference, ESTC 2016. IEEE, 2016. 7764732.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Comparative study on radio frequency and reliability performance of electronically conductive adhesives

AU - Österlund, Elmeri

AU - Vuorinen, Vesa

AU - Jokilahti, Juha

AU - Galkin, Timo

AU - Salmela, Olli

AU - Paulasto-Krockel, Mervi

N1 - Conference code: 6

PY - 2016/12/1

Y1 - 2016/12/1

N2 - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

AB - ECAs are nowadays used as a lead-free replacement for solders. They are used in microelectronics for packaging, bonding of surface mount devices, in flip chip and in ball grid arrays and in LCD screens. Benefits of ECAs over solders include lower temperature and simpler processing, environmental friendliness, finer pitch and lower thermomechanical stresses. However, ECAs have higher overall electrical resistance and they are not as reliable.

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DO - 10.1109/ESTC.2016.7764732

M3 - Conference article in proceedings

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BT - 2016 6th Electronic System-Integration Technology Conference, ESTC 2016

PB - IEEE

T2 - Electronic System Integration Technology Conference

Y2 - 13 September 2016 through 16 September 2016

ER -

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Abstract

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