COMPARATIVE STUDY OF THE MECHANICAL PROPERTIES OF BONDING WIRE

S. P. Hannula*, J. Wanagel, C. Y. Li

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

3 Citations (Scopus)

Abstract

This study was undertaken to investigate the mechanical behavior of bonding wires. Beryllium doped gold and aluminum 1-percent silicon wires from three different manufacturers were tested to determine the elastic, tensile and load relaxation properties. The stiffness (modulus) of the wires was found to depend on the method of fabrication as well as on thermal and mechanical history. Although the specified breaking load and elongation values of the wires were essentially the same, load relaxation tests revealed substantial differences in the time dependent flow properties of the wires.

Original languageEnglish
Title of host publicationASTM Special Technical Publication
EditorsDinesh C. Gupta
PublisherAMERICAN SOCIETY FOR TESTING AND MATERIALS
Pages485-499
Number of pages15
ISBN (Print)0803104030
Publication statusPublished - 1984
MoE publication typeA4 Article in a conference publication
EventSymposium on Semiconductor Processing - San Jose, CA, United States
Duration: 1 Jan 19841 Jan 1984
Conference number: 3

Publication series

NameASTM special technical publication
PublisherAmerican Society for Testing and Materials
ISSN (Print)0066-0558

Conference

ConferenceSymposium on Semiconductor Processing
CountryUnited States
CitySan Jose, CA
Period01/01/198401/01/1984

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