Combined Electrical and Thermal Circuit Simulation Using APLAC.Part C: Thermal Spreading Impedance Models

T. Veijola, L. Costa

    Research output: Working paperProfessional

    Original languageEnglish
    Place of PublicationEspoo
    Pages54
    Publication statusPublished - 1998
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameCircuit Theory Laboratory Report Series
    PublisherHelsinki University of Technology, Circuit Theory Laboratory
    No.CT-34
    ISSN (Print)1239-8233

    Keywords

    • APLAC
    • electrothermal model
    • electrothermal simulation
    • thermal impedance
    • thermal spreading impedance

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