Chip-to-chip communications using capacitive interconnects

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

1 Citation (Scopus)
Original languageEnglish
Title of host publicationIEEE International Symposium on Circuits and Systems (ISCAS), May 30 - June 2, 2010
Pages2888-2891
Publication statusPublished - 2010
MoE publication typeA4 Article in a conference publication

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