Boundary Conditions for Using Anisotropic Adhesives for Flip-Chip Bonding

P. Savolainen, J. Kivilahti

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationThe Proc. of Second European Conference on Microelectronics Packaging, Essen Germany, 1-3.2 1996
Pages51
Publication statusPublished - 1996
MoE publication typeA4 Article in a conference publication

Keywords

  • anisotropic adhesives
  • boundary conditions
  • flip-chip

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