Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives, Non-conductive adhesives and Fusible Coatings

K. Puhakka, K. Kulojärvi, P. Savolainen, J.K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)209-216
    JournalInternational Journal of Microelectronic Packaging Materials and Technologies
    Volume1
    Issue number3
    Publication statusPublished - 1998
    MoE publication typeA1 Journal article-refereed

    Keywords

    • Bonding
    • Flexible Circuit
    • Flip Chip
    • Fusible Coating
    • Non-Conductive Adhesive
    • Solder-Filled Z-adhesive

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