@article{532aee10c67f4e8abe7ac0f1257eae94,
title = "Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives, Non-conductive adhesives and Fusible Coatings",
keywords = "Bonding, Flexible Circuit, Flip Chip, Fusible Coating, Non-Conductive Adhesive, Solder-Filled Z-adhesive, Bonding, Flexible Circuit, Flip Chip, Fusible Coating, Non-Conductive Adhesive, Solder-Filled Z-adhesive, Bonding, Flexible Circuit, Flip Chip, Fusible Coating, Non-Conductive Adhesive, Solder-Filled Z-adhesive",
author = "Kimmo Puhakka and Kari Kuloj{\"a}rvi and P. Savolainen and J.K. Kivilahti",
year = "1998",
language = "English",
volume = "1",
pages = "209--216",
journal = "International Journal of Microelectronic Packaging Materials and Technologies",
issn = "1023-6228",
publisher = "Gordon and Breach - Harwood Academic",
number = "3",
}