Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives

K. Kulojärvi, P. Savolainen, J. Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	2nd International Conference on Adhesives in Electronics Manufacturing , Stockholm, Sweden
Place of Publication	Stockholm
Publication status	Published - 1996
MoE publication type	A4 Conference publication

Keywords

@inproceedings{461440e7d69c4f388207d578a3ceb7e0,

title = "Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives",

keywords = "flexible circuits, flip Chip, flexible circuits, flip Chip, flexible circuits, flip Chip",

author = "K. Kuloj{\"a}rvi and P. Savolainen and J. Kivilahti",

year = "1996",

language = "English",

booktitle = "2nd International Conference on Adhesives in Electronics Manufacturing , Stockholm, Sweden",

}

TY - GEN

T1 - Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives

AU - Kulojärvi, K.

AU - Savolainen, P.

AU - Kivilahti, J.

PY - 1996

Y1 - 1996

KW - flexible circuits

KW - flip Chip

KW - flexible circuits

KW - flip Chip

KW - flexible circuits

KW - flip Chip

M3 - Conference article in proceedings

BT - 2nd International Conference on Adhesives in Electronics Manufacturing , Stockholm, Sweden

CY - Stockholm

ER -