Bonding Flexible Circuits and Flip Chips with Solder-filled Z-adhesives

K. Kulojärvi, P. Savolainen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication2nd International Conference on Adhesives in Electronics Manufacturing , Stockholm, Sweden
    Place of PublicationStockholm
    Publication statusPublished - 1996
    MoE publication typeA4 Article in a conference publication


    • flexible circuits
    • flip Chip

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