Bond Strength of Wood Adhesives: The Sensitivity of Standard Test Methods to Imperfections

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Abstract

The aim of this paper is to highlight some drawbacks and uncertainties related to possible imperfections associated with the use of key European and American standard test methods on shear strength measurement of wood adhesive bonds. For this purpose, a brief introduction is provided on adhesive bonding of wood materials and relevant failure modes under shear stress. Two standardized test methods for measuring the shear strength of wood adhesives are introduced, followed by a discussion around the drawbacks and imperfections related to the practical application of the two test methods. Finally, the research needs in this area are highlighted and some recommendations are made for addressing them in the future studies.
Original languageEnglish
Title of host publicationProceedings of the 2020 Society of Wood Science and Technology International Convention, "Renewable Resources for a Sustainable and Healthy Future"
PublisherSociety of Wood Science & Technology
Pages507-514
Number of pages8
ISBN (Electronic)978-1-7340485-0-6
Publication statusPublished - Jul 2020
MoE publication typeB3 Non-refereed article in conference proceedings
EventSociety of Wood Science and Technology International Convention - Portoroz, Slovenia
Duration: 12 Jul 202015 Jul 2020
Conference number: 63

Conference

ConferenceSociety of Wood Science and Technology International Convention
Abbreviated titleSWST
CountrySlovenia
CityPortoroz
Period12/07/202015/07/2020

Keywords

  • wood adhesives
  • bond strength
  • percentage of wood failure
  • bond line thickness
  • adhesive spread rate
  • growth ring orientation
  • imperfection

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  • Cite this

    Derikvand, M., & Fink, G. (2020). Bond Strength of Wood Adhesives: The Sensitivity of Standard Test Methods to Imperfections. In Proceedings of the 2020 Society of Wood Science and Technology International Convention, "Renewable Resources for a Sustainable and Healthy Future" (pp. 507-514). Society of Wood Science & Technology.