@inbook{73391ed4e45c47f0a828586a15595b4e,
title = "Board-level Reliability of Lead-Free Solder Interconnections under Mechanical Shock and Vibration Loads",
keywords = "drop reliability, failure modes and mechanisms under fast deformation rates, shock reliability, vibration reliability, drop reliability, failure modes and mechanisms under fast deformation rates, shock reliability, vibration reliability, drop reliability, failure modes and mechanisms under fast deformation rates, shock reliability, vibration reliability",
author = "Mattila, {Toni Tuomas} and Pekka Marjam{\"a}ki and Jorma Kivilahti",
year = "2011",
doi = "10.1002/9780470950012.ch17",
language = "English",
isbn = "978-0470250020",
pages = "371--414",
editor = "{Ephraim Suhir}, {David S.Steinberg}",
booktitle = "Structural Dynamics of Electronic and Photonic Systems",
publisher = "Wiley",
address = "United Kingdom",
}