Board-level Reliability of Lead-Free Solder Interconnections under Mechanical Shock and Vibration Loads

Toni Tuomas Mattila, Pekka Marjamäki, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    5 Citations (Scopus)
    Original languageEnglish
    Title of host publicationStructural Dynamics of Electronic and Photonic Systems
    EditorsDavid S.Steinberg Ephraim Suhir
    Place of PublicationNew Jersey, USA
    PublisherWiley
    Pages371-414
    ISBN (Print)978-0470250020
    DOIs
    Publication statusPublished - 2011
    MoE publication typeA3 Book section, Chapters in research books

    Keywords

    • drop reliability
    • failure modes and mechanisms under fast deformation rates
    • shock reliability
    • vibration reliability

    Cite this