Bismuth-filled Anisotropically Conductive Adhesive for Flip Chip Bonding

M. Vuorela, J. Kivilahti, M. Holloway, S. Fuchs, F. Stam

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    3 Citations (Scopus)
    Original languageEnglish
    Title of host publicationAdhesives in Electronics 2000, Helsinki, 18.-21.6.2000
    EditorsJ. Kivilahti, M. Hyytiäinen
    Place of PublicationHelsinki
    PublisherHelsinki University of Technology, Electronics Production Technology, IEEE CPMT Finnish Chapter
    Pages147-152
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • Adhesives
    • anisotropically conductive adhesive
    • Bismunth
    • Flip Chip bonding

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