@inproceedings{b99cad8f2c5346ab9d03d02195bca545,
title = "Bismuth-filled Anisotropically Conductive Adhesive for Flip Chip Bonding",
keywords = "Adhesives, anisotropically conductive adhesive, Bismunth, Flip Chip bonding, Adhesives, anisotropically conductive adhesive, Bismunth, Flip Chip bonding, Adhesives, anisotropically conductive adhesive, Bismunth, Flip Chip bonding",
author = "M. Vuorela and J. Kivilahti and M. Holloway and S. Fuchs and F. Stam",
year = "2000",
language = "English",
pages = "147--152",
editor = "J. Kivilahti and M. Hyyti{\"a}inen",
booktitle = "Adhesives in Electronics 2000, Helsinki, 18.-21.6.2000",
publisher = "Helsinki University of Technology",
address = "Finland",
}