Atomic Layer Deposition of Copper Metal Films from Cu(acac)2 and Hydroquinone Reductant

Tripurari Sharan Tripathi, Martin Wilken, Christian Hoppe, Teresa de los Arcos, Guido Grundmeier, Anjana Devi, Maarit Karppinen*

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

8 Citations (Scopus)
233 Downloads (Pure)

Abstract

High-quality copper metal thin films are demanded for a number of advanced technologies. Herein, a facile ALD (atomic layer deposition) process for the fabrication of Cu metal films directly from two solid readily usable precursors, copper acetylacetonate as the source of copper and hydroquinone as the reductant is reported. This process yields highly crystalline, dense, specularly reflecting, and electrically conductive Cu films with an appreciably high growth rate of 1.8 Å/cycle at deposition temperatures as low as 160 to 240 °C.

Original languageEnglish
Article number2100446
Number of pages6
JournalAdvanced Engineering Materials
Volume23
Issue number10
Early online date26 Jul 2021
DOIs
Publication statusPublished - Oct 2021
MoE publication typeA1 Journal article-refereed

Keywords

  • ALD
  • Copper metal film
  • Cu(acac)
  • Direct reduction
  • Hydroquinone

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