Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

Amin Enayati, W. De Raedt, S. Brebels, G.A.E. Vandenbosch, Antti V. Räisänen

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

5 Citations (Scopus)

Original language	English
Title of host publication	MTT IEEE MTT-S Microw. Symp. Dig., Baltimore, Maryland, USA, June 5-10, 2011
Place of Publication	Baltimore, Maryland
Publication status	Published - 2011
MoE publication type	A4 Conference publication

Cite this

@inproceedings{374df89677824c32bf6eced2d29e8017,

title = "Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology",

author = "Amin Enayati and \{De Raedt\}, W. and S. Brebels and G.A.E. Vandenbosch and R{\"a}is{\"a}nen, \{Antti V.\}",

year = "2011",

language = "English",

booktitle = "MTT IEEE MTT-S Microw. Symp. Dig., Baltimore, Maryland, USA, June 5-10, 2011",

}

Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology. / Enayati, Amin; De Raedt, W.; Brebels, S. et al.
MTT IEEE MTT-S Microw. Symp. Dig., Baltimore, Maryland, USA, June 5-10, 2011. Baltimore, Maryland, 2011.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Antenna-in-package solution for 3D integration of millimeter-wave systems using a thin-film MCM technology

AU - Enayati, Amin

AU - De Raedt, W.

AU - Brebels, S.

AU - Vandenbosch, G.A.E.

AU - Räisänen, Antti V.

PY - 2011

Y1 - 2011

UR - https://www.scopus.com/pages/publications/80052305119

M3 - Conference article in proceedings

BT - MTT IEEE MTT-S Microw. Symp. Dig., Baltimore, Maryland, USA, June 5-10, 2011

CY - Baltimore, Maryland

ER -