Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review


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Original languageEnglish
Title of host publicationESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication

ID: 621717