Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

Vesa Vuorinen, Hongqun Dong, Hongbo Xu, Sami Vähänen, Tommi Suni, Tomi Laurila, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam
PublisherIEEE CPMT
ISBN (Print)978-1-4673-4645-0
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication

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