Original language | English |
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Title of host publication | ESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam |
Publisher | IEEE |
ISBN (Print) | 978-1-4673-4645-0 |
Publication status | Published - 2012 |
MoE publication type | A4 Conference publication |
Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vesa Vuorinen, Hongqun Dong, Hongbo Xu, Sami Vähänen, Tommi Suni, Tomi Laurila, Mervi Paulasto-Kröckel
Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
2
Citations
(Scopus)