An Extended Multilayer Thermal Model for Multichip IGBT Modules Considering Thermal Aging

Mohsen Akbari, Mohammad Tavakoli Bina, Amir Sajjad Bahman, Bahman Eskandari, Edris Pouresmaeil*, Frede Blaabjerg

*Corresponding author for this work

Research output: Contribution to journalArticleScientificpeer-review

13 Citations (Scopus)
184 Downloads (Pure)


An accurate and real-time knowledge of temperatures in insulated-gate bipolar transistormodules is crucial for reliability analysis and thermal management of power electronic converters. Forthis purpose, this paper establishes an integrated thermal equivalent circuit model comprising self-heatingthermal impedances and cross-heating thermal impedances to provide a temperature profile of the junctionand solder joints during various operations and in the case of thermal aging. The thermal resistance andcapacitance parameters of the thermal impedances are characterized in terms of different electro-thermaloperating conditions and solder joints aging conditions with the help of three-dimensional finite elementsimulations. Also, the effect of the heatsink, which brings an uneven heat transfer coefficient distributionat the module baseplate, is investigated and modeled into the thermal impedances. The introduced thermalmodel can work even if the conditions change simultaneously. The accuracy of the model is verified byexperiments and finite element simulations, all of which agree with negligible error unlike thermal modelsgiven in the datasheet and fixed-parameter thermal models.
Original languageEnglish
Article number9439476
Pages (from-to) 84217-84230
Number of pages14
JournalIEEE Access
Publication statusPublished - 25 May 2021
MoE publication typeA1 Journal article-refereed


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