An Approach to Board-Level Drop Reliability Evaluation with Improved Correlation with Use Conditions

Engineering

• Correlation 100%
• Reliability Evaluation 100%
• Maximum Strain 26%
• Supports 15%
• Deceleration 15%
• Development 10%
• Portable Electronics 10%
• Mechanical Structure 10%
• Environment 5%
• Products 5%
• Internals 5%
• Maximum Value 5%
• Loading Condition 5%
• Frequency Vibration 5%
• Electronic Devices 5%
• High Strain 5%
• Test Board 5%
• Finite Element Simulation 5%
• Millisecond 5%
• Printed Circuit Board 5%
• Point Support 5%
• Average Rate 5%
• Electronic Product 5%
• Reliability Assessment 5%
• Free Fall 5%
• Micro Strain 5%
• Input Pulse 5%
• Average Strain Rate 5%
• Significant Change 5%

Material Science

• Correlation 100%
• Strain 100%
• Bending 15%
• Strain Rate 15%
• Electronics 5%
• Devices 5%
• Electronic Device 5%
• Finite Element Methods 5%