Original language | English |
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Title of host publication | APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011 |
Publisher | IEEE CPMT |
Pages | 362-372 |
Publication status | Published - 2011 |
MoE publication type | A4 Article in a conference publication |
Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Jarmo Kemppainen, Toni T. Mattila, Mervi Paulasto-Kröckel
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review
2
Citations
(Scopus)