Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing

Jarmo Kemppainen, Toni T. Mattila, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

1 Citation (Scopus)

Original language	English
Title of host publication	APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011
Publisher	IEEE CPMT
Pages	362-372
Publication status	Published - 2011
MoE publication type	A4 Article in a conference publication

Cite this

@inproceedings{5c62fa8e139543a2ba13365bd59678a8,

title = "Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing",

author = "Jarmo Kemppainen and Mattila, {Toni T.} and Mervi Paulasto-Kr{\"o}ckel",

year = "2011",

language = "English",

pages = "362--372",

booktitle = "APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011",

publisher = "IEEE CPMT",

}

APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011. IEEE CPMT, 2011. p. 362-372.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing

AU - Kemppainen, Jarmo

AU - Mattila, Toni T.

AU - Paulasto-Kröckel, Mervi

PY - 2011

Y1 - 2011

UR - http://ieeexplore.ieee.org/Xplore/guesthome.jsp

M3 - Conference contribution

SP - 362

EP - 372

BT - APM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011

PB - IEEE CPMT

ER -