Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing

Jarmo Kemppainen, Toni T. Mattila, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publicationAPM International Symposium on Advanced Packaging Materials (APM), Xiamen, China, 25-28 Oct. 2011
PublisherIEEE CPMT
Publication statusPublished - 2011
MoE publication typeA4 Article in a conference publication

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