Adhesion Between Photosensitive Epoxy and Electroless Copper

J. Ge, R. Tuominen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    2 Citations (Scopus)
    Original languageEnglish
    Title of host publicationAdhesives in Electronics 2000, Helsinki, 18.-21.6.2000
    EditorsJ. Kivilahti, M. Hyytiäinen
    Place of PublicationHelsinki
    PublisherHelsinki University of Technology, Electronics Production Technology, IEEE CPMT Finnish Chapter
    Pages248-252
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • adhesion
    • electroless copper
    • photosensitive epoxy

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