Adhesion Between Photosensitive Epoxy and Electroless Copper

J. Ge, R. Tuominen, J.K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)1133-1144
    JournalJournal of Adhesion Science and Technology
    Volume15
    Issue number10
    Publication statusPublished - 2001
    MoE publication typeA1 Journal article-refereed

    Keywords

    • adhesion
    • electroless copper
    • photosensitive epoxy

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