A Survey of Carbon Nanotube Interconnects for Energy Efficient Integrated Circuits

Aida Todri-Sanial, Raphael Ramos, Hanako Okuno, Jean Dijon, Abitha Dhavamani, Marcus Wislicenus, Katharina Lilienthal, Benjamin Uhlig, Toufik Sadi, Vihar Georgiev, Asen Asenov, Salvatore Amoroso, Andrew Pender, Andrew Brown, Campbell Millar, Fabian Motzfeld, Bernd Gotsmann, Jie Liang, Goncalo Gonçalves, Nalin RupesingheKen Teo

Research output: Contribution to journalReview ArticleScientificpeer-review

16 Citations (Scopus)

Abstract

This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current copper interconnects, 2) process & growth of carbon nanotube interconnects compatible with back-end-of-line integration, and 3) modeling and simulation for circuit-level benchmarking and performance prediction. The focus is on the evolution of carbon nanotube interconnects from the process, theoretical modeling, and experimental characterization to on-chip interconnect applications. We provide an overview of the current advancements on carbon nanotube interconnects and also regarding the prospects for designing energy efficient integrated circuits. Each selected category is presented in an accessible manner aiming to serve as a survey and informative cornerstone on carbon nanotube interconnects relevant to students and scientists belonging to a range of fields from physics, processing to circuit design.

Original languageEnglish
Article number7932093
Pages (from-to)47-62
Number of pages16
JournalIEEE CIRCUITS AND SYSTEMS MAGAZINE
Volume17
Issue number2
DOIs
Publication statusPublished - 1 Apr 2017
MoE publication typeA2 Review article in a scientific journal

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