A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

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Original languageEnglish
Title of host publicationInternational Student Conference Printing Future Days, Chemnitz, Germany, 2009
Publication statusPublished - 2009
MoE publication typeA4 Article in a conference publication

    Research areas

  • coating structure, electrophotography, heatset offset, modelling, particle deposition, Porous media, thermal calendering, thermal conductivity, web drying

ID: 2369517