A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model

Philip Gerstner, Cathy J. Ridgway, Jouni Paltakari, Patrick A.C. Gane

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationInternational Student Conference Printing Future Days, Chemnitz, Germany, 2009
    Pages259-266
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication

    Keywords

    • coating structure
    • electrophotography
    • heatset offset
    • modelling
    • particle deposition
    • Porous media
    • thermal calendering
    • thermal conductivity
    • web drying

    Cite this

    Gerstner, P., Ridgway, C. J., Paltakari, J., & Gane, P. A. C. (2009). A structural analysis of the thermal conductivity of paper coatings: application of particle deposition simulation to a lumped parameter model. In International Student Conference Printing Future Days, Chemnitz, Germany, 2009 (pp. 259-266)